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Multi-scale simulation on dynamic performance of an integrated pumping and compression evaporative electronic cooling system

Yin, Xiang, Cao, F, Shu, P and Wang, X ORCID: 0000-0003-4293-7523 2018 , 'Multi-scale simulation on dynamic performance of an integrated pumping and compression evaporative electronic cooling system' , Applied Thermal Engineering, vol. 129 , pp. 318-328 , doi: https://doi.org/10.1016/j.applthermaleng.2017.10.008.

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Abstract

Two-phase evaporative cooling technology has been widely used for the electronic cooling. In this paper,dynamic performance of an integrated pumping and compression evaporative electronic cooling systemwas experimentally and theoretically investigated during the system mode variation. A mathematicalmodel was developed based on the ANSYS fluent and validated using experimental data. The resultsshowed a sharp increase in the cooling temperature before the stable cooling condition was achievedas the system operating mode changed to meet the heat load variation. The model was then used toinvestigate the influence of the different opening and closing order of the valves on the flow rate distributionswhen the cooling system was switched from liquid-pumping mode to vapor-compression mode.The results showed that the valve sequences had a large influence on the flow distributions during theswitching process. This valve sequence substantially influenced the cooling peak temperature whenthe control time for the whole switching process was longer than 16 s. This analysis indicated that anappropriate valve sequence could reduce the sharp change of cooling temperature and increase the coolingperformance during the system switching process.

Item Type: Article
Authors/Creators:Yin, Xiang and Cao, F and Shu, P and Wang, X
Keywords: electronic cooling, two phase evaporative cooling, liquid pumping, vapor compression, system control
Journal or Publication Title: Applied Thermal Engineering
Publisher: Pergamon-Elsevier Science Ltd
ISSN: 1359-4311
DOI / ID Number: https://doi.org/10.1016/j.applthermaleng.2017.10.008
Copyright Information:

Copyright 2017 Elsevier Ltd.

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