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Assessment and characterizing mechanical damage in packaged bananas in the post-harvest supply chain


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Fernando, MI, Fei, J ORCID: 0000-0002-4090-5299, Stanley, R ORCID: 0000-0002-2279-5022 and Enshaei, H ORCID: 0000-0002-5649-7015 2019 , 'Assessment and characterizing mechanical damage in packaged bananas in the post-harvest supply chain', in E Zahran and R Montemanni (eds.), MATEC Web of Conferences , EDP Sciences, France, pp. 1-10 , doi: 10.1051/matecconf/201929602004.

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Quality deterioration in packaged bananas caused by mechanical damage along the post-harvest supplychains (SC) remains obscure until the packages are unpacked for sale at the retail stores and therefore, the mechanismof damage occurrence remains unclear. This study assessed the mechanical damage levels of bananas in 300 cartonsfrom pack houses to retail stores in Australia. The damage across the SC were shown to be progressive across the SC.Bruising and neck damage levels in bananas increased from the distribution centre (DC) to the retail stores.Mechanical damage in unripe bananas was influenced by the package location in the stacked-pallet, and the transportand handling of packages within the last-mile of the SC (DC to retail) further exacerbated the damage. This studyfurther characterized the damage development by subjecting packaged bananas to simulated vibration, top-loadcompression and drop impact. It was revealed that the exposure to vibration resulted in rubbing; top-load packagecompression contributed to bruising and, the drop impact caused severe neck injuries in bananas. The knowledge ofthe damage incidences across the SC and causes of damage may contribute to the development of interventionstargeted at improving the quality of bananas in the post-harvest SC in Australia.

Item Type: Conference Publication
Authors/Creators:Fernando, MI and Fei, J and Stanley, R and Enshaei, H
Keywords: fruit, bananas, transport, damage assessment, vibration, mechanical damage, food supply chain
Journal or Publication Title: MATEC Web of Conferences
Publisher: EDP Sciences
ISSN: 2261-236X
DOI / ID Number: 10.1051/matecconf/201929602004
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Copyright The Authors Creative Commons Attribution License 4.0

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