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Thermal performance of insulated gate bipolar transistor module using microchannel cooling base plate

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Abstract
The insulated gate bipolar transistor (IGBT) module cannot meet industrial requirements under high-power density due to the high junction temperature and non-uniform temperature distribution. To overcome these problems, two novel microchannel designs (i.e. longitudinal counter-flow microchannel and horizontal counter-flow microchannel) were proposed for the base plate cooling of the IGBT module, in this study. A heat transfer model was developed to investigate the heat transfer performance, pressure drop, temperature distribution of a full-size IGBT module with the proposed microchannel cooling designs. The results showed that the horizontal counter-flow microchannel design had better heat transfer performance, lower pressure drop, more uniform temperature distribution and higher energy efficiency in comparison to the longitudinal counter-flow microchannel cooling design. To further improve the heat transfer performance, longitudinal vortex generators was applied in the horizontal counter-flow microchannel design. It was found that the Nusselt number of the horizontal counter-flow microchannel with longitudinal vortex generators reached 10.86, which increased by 61% compared with the basic horizontal counter-flow microchannel design.
Item Type: | Article |
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Authors/Creators: | Shi, M and Yu, X and Tan, Y and Wang, X and Zhang, X and Li, J |
Keywords: | IGBT module, microchannels, thermal performance, longitudinal vortex generators |
Journal or Publication Title: | Applied Thermal Engineering |
Publisher: | Pergamon-Elsevier Science Ltd |
ISSN: | 1359-4311 |
DOI / ID Number: | 10.1016/j.applthermaleng.2021.117718 |
Copyright Information: | © 2021 Elsevier Ltd. |
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Item Statistics: | View statistics for this item |
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